Technical Details

• Package / Case 760-BFBGA, FCBGA
• Mounting Type Surface Mount
• Interface CANbus, I2C, McASP, SPI, UART
• Type Floating Point
• Operating Temperature -40°C ~ 125°C (TJ)
• Non-Volatile Memory ROM (256kB)
• On-Chip RAM 2.5MB
• Voltage - I/O 1.35V, 1.8V, 3.3V
• Voltage - Core 1.15V
• Clock Rate 1.5GHz
• Supplier Device Package 760-FCBGA (23x23)