技术参数

• Connector Type SO-DIMM-200
• Size / Dimension 2.660" L x 2.000" W (67.60mm x 50.80mm)
• Speed 456MHz
• RAM Size 128MB
• Operating Temperature 0°C ~ 70°C
• Module/Board Type MPU, DSP, FPGA Core
• Core Processor ARM926EJ-S, OMAP-L138
• Co-Processor TMS320C674x (DSP)
• Flash Size 256MB (NAND), 16MB (NOR)
• California Prop 65 California Prop 65 Information
• ECCN 3A991A2
• HTSUS 8471.50.0150
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• RoHS Status ROHS3 Compliant