技术参数

• Package / Case 88-VFLGA Exposed Pad
• Speed 100MHz
• RAM Size 128kB
• Number of I/O 36
• Operating Temperature -40°C ~ 85°C (TA)
• Core Processor ARM® Cortex®-M4F
• Connectivity Bluetooth, I2C, SPI, UART
• Peripherals DMA, I2S, PWM, WDT
• Supplier Device Package 88-LGA (10x10)
• Architecture MCU
• Flash Size 512kB
• ECCN 5A992C SC
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant