技术参数

• Package / Case 325-LFBGA
• RAM Size 857.6kB
• Operating Temperature -40°C ~ 100°C
• Core Processor RISC-V
• Primary Attributes FPGA - 93K Logic Modules
• Connectivity CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
• Peripherals DMA, PCI, PWM
• Supplier Device Package 325-LFBGA (11x14.5)
• Architecture MPU, FPGA
• Flash Size 128KB
• ECCN 3A991D
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected