技术参数

• Package / Case 132-BFPGA
• Mounting Type Through Hole
• Speed 25MHz
• Operating Temperature 0°C ~ 70°C (TA)
• Core Processor M68000
• Voltage - I/O 5V
• Supplier Device Package 132-PGA (39.63x39.63)
• Number of Cores/Bus Width 1 Core, 8-Bit, 16-Bit
• Co-Processors/DSP Communications; RISC CPM
• RAM Controllers DRAM
• Graphics Acceleration No
• Additional Interfaces GCI, IDL, ISDN, NMSI, PCM, SCPI
• ECCN 3A991
• HTSUS 8542.31.0001
• REACH Status Vendor Undefined
• RoHS Status RoHS non-compliant