技术参数

• Package / Case 208-LQFP Exposed Pad
• Mounting Type Surface Mount
• Interface Host Interface, I2C, McASP, McBSP
• Type Floating Point
• Operating Temperature -40°C ~ 105°C (TC)
• Non-Volatile Memory External
• On-Chip RAM 264kB
• Voltage - I/O 3.30V
• Voltage - Core 1.20V
• Clock Rate 200MHz
• Supplier Device Package 208-HLQFP (28x28)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 4 (72 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant