技术参数

• Features SPI
• Package / Case 356-BBGA Exposed Pad
• Mounting Type Surface Mount
• Operating Temperature -40°C ~ 85°C (TA)
• Applications Video
• -3db Bandwidth 300MHz
• Supplier Device Package 356-HPBGA (27x27)
• Voltage - Supply, Single (V+) 4.5V ~ 5.5V
• Multiplexer/Demultiplexer Circuit 32:32
• Number of Channels 1
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant