技术参数

• Package / Case 515-WFBGA, FCBGA
• Mounting Type Surface Mount
• Interface 1-Wire®, EBI/EMI, I2C, McBSP, McSPI, MMC/SD, UART, USB, USB OTG
• Type Digital Media System-on-Chip (DMSoC)
• Operating Temperature -40°C ~ 90°C (TJ)
• Non-Volatile Memory ROM (32kB)
• On-Chip RAM 384kB
• Voltage - I/O 1.80V
• Voltage - Core 1.10V
• Clock Rate 1GHz
• Supplier Device Package 515-POP-FCBGA (12x12)
• ECCN 5A992C
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant