技术参数

• Package / Case 256-LBGA
• Speed 100MHz
• RAM Size 16KB
• Number of I/O MCU - 26, FPGA - 66
• Operating Temperature -40°C ~ 100°C (TJ)
• Core Processor ARM® Cortex®-M3
• Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
• Connectivity EBI/EMI, I2C, SPI, UART/USART
• Peripherals DMA, POR, WDT
• Supplier Device Package 256-FPBGA (17x17)
• Architecture MCU, FPGA
• Flash Size 128KB
• ECCN 3A991D
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status RoHS non-compliant