技术参数

• Package / Case 625-BFBGA, FCBGA
• Mounting Type Surface Mount
• Interface DDR3, EBI/EMI, Ethernet, McBSP, PCIe, I2C, SPI, UART, UPP
• Type Fixed/Floating Point
• Operating Temperature 0°C ~ 85°C (TC)
• Non-Volatile Memory ROM (128kB)
• On-Chip RAM 1.06MB
• Voltage - I/O 1.0V, 1.5V, 1.8V
• Voltage - Core 1.00V
• Clock Rate 850MHz
• Supplier Device Package 625-FCBGA (21x21)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant